FRAM-based MCUs optimise board space and save power

8th April 2014

Nat Bowers

0 0

Expanding the availability of tiny package sizes to several additional families of ultra-low power MSP430 microcontrollers, Texas Instruments enables developers to save valuable board space. The ultra-low power FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs are now available in wafer-level chip scale packages (WLCSP) as small as 2.0x2.2x0.3mm.

These tiny package sizes make the MSP430 MCUs suited for a variety of ultra-low power applications such as sensor hubs, digital credit cards, ingestible sensors, health and fitness products like smart watches, and consumer electronics such as tablets and notebooks.

Devices with embedded FRAM memory such as MSP430FR5738 MCUs provide longer battery lifetime for ultra-low power data logging applications. Available with 1.8V I/O, the MSP430F5229 MCUs enable applications with advanced sensor fusion capabilities such as gesture recognition, motion tracking, environment sensing and contextual awareness.

The range of 1.8 and 5V tolerant I/O on the MSP430F51x2 MCUs allow developers to interface with a broader range of components, in addition to a PWM timer for high-resolution applications. A broad GPIO range (32-53) allows MSP430 MCUs flexibility in the system, enabling more advanced features like environmental sensors. An ecosystem of libraries and support eases USB development on MSP430F5528 MCUs in consumer electronics applications such as smart phones, notebooks and tablets.

The ultra-low power MSP430 MCUs are available immediately with tiny package sizes (WLCSP) starting at $1.08 (USD) in 1,000 unit quantities.