Micros
Flash microcontroller in a compact 10x10mm BGA package
Renesas Technology Europe announced today an expansion to its successful SH708x-line-up with a version of the SH7083F Flash microcontroller in a compact 10x10mm and 1.4mm thickness BGA package. This device delivers 104 Dhrystone MIPS out of its 256Kbyte/512KByte embedded MONOS Flash memory and yet takes up only 140mm3. Such a level of CPU performance has so far not been available to applications with extreme space constraints such as sensors, cameras lenses and small medical applications (e.g. hearing aids).
“RThe device has a modern 32-bit RISC CPU with 16 general purpose registers each 32-bit wide. The CPU has a 32x32 Multiply-Accumulate Unit (MAC) for DSP-algorithms. The SH7083F is available in 256Kbyte Flash / 16Kbyte RAM and 512Kbyte Flash / 32Kbyte RAM versions. The peripheral set includes the powerful MTU2 timer unit, a flexible bus state controller (BSC), a Direct Memory Access Controller (DMAC) as well as the flexible Data Transfer Controller (DTC). Connectivity is offered via 4 serial ports (one with 16 Byte FIFO), SPI, IIC and up to 65 GPIO. The device also has two fast 10-bit ADC each with a Sample&Hold unit.
Samples of the SH7083F in the new BGA package are available now. A low cost starter kit (RSK7086, RRP 150€) includes a development board, E8 debugger, small LCD and software. For a more sophisticated development environment, customers can chose to purchase the E10A debugger, E200F emulator or the Trace32-ICD from Renesas Alliance Partner Lauterbach.