Micros

Infineon is adding the XMC7000 series to its microcontroller portfolio. The new MCU family includes a single- or a dual-core Arm Cortex-M7 core, both with Arm Cortex-M0+ support.

Fujipoly recently released SARCON GR100A series, its newest high-performance, thermal gap filler pad.

STMicroelectronics has released high-power modules for electric vehicles that boost performance and driving range.

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

As of now, Lauterbach, with its TRACE32 development tools, also support the Zephyr OS real-time operating system (RTOS) when running on SiFive RISC-V CPUs implemented in Microchip's PolarFire FPGA SoCs (OS awareness).

Semiconductor test equipment supplier Advantest Corporation has unveiled the E5620 Defect Review Scanning Electron Microscope (DR-SEM), its newest mask SEM product for reviewing and classifying ultra-small defects on photomasks and mask blanks.

Future Market Insights published a report, titled, "Micro Inverter Market by phase, connectivity, application & region: global opportunity analysis and industry forecast, 2022-2032".

Menlo Micro has introduced a micromechanical power switch capable of handling 10A in a miniature 5mm x 5mm surface-mount package.

STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.

Search for the Next (SFN), developers of the Bizen wafer process, Zpolar transistor and Zpolar Tunnel Logic (ZTL), announced the WaferTrain network of foundries that is equipped with the Bizen wafer process and with capacity available now to build ICs that are equivalent to 180nm CMOS devices, yet are half the price and on shorter lead times.