Micros

The world’s first fully integrated and functional microchip based on exotic two-dimensional materials has been fabricated at KAUST.

CUI Devices’ Audio Group announces the addition of three new MEMS microphone models boasting wide frequency ranges from 20 to 20,000Hz.

In stock at distributor Mouser Electronics is the RZ/T2L high-performance microprocessor with EtherCAT from Renesas Electronics.

New D2LS miniature surface-mount micro switches from Omron combine tiny dimensions with a positive mechanical action comparable to larger switches, while ensuring outstanding long-term durability.

ARIES Embedded has announced the new FIVEberry embedded system offering a smooth and fast start into computing projects. 

Small DC motor supplier Electro Mechanical Systems (EMS) will be exhibiting the complete range of FAULHABER L series linear actuators at this year’s Design Engineering Expo, taking place at the NEC in Birmingham on 7―8 June 7 2023.

Electronic Specifier takes a look at the top 5 micro products to have been released in May 2023.

Cambridge GaN Devices (CGD) has introduced a range of Application Interface Boards that allow designers to try out the company’s rugged, easy-to-use ICeGaN HEMTs in existing circuits in place of competing MOSFET or GaN devices without having to re-layout the PCB.

Apple has reached a multi-billion dollar deal with chipmaker Broadcom to use more US-made parts. This highlights a reconsidering of the tech titan’s global manufacturing plans as it pivots investment from China to the US.

Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach $29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the $26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.