'World's first' 8Gb DDR3 components with single chip-select

16th July 2014

Siobhan O'Gorman

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8Gb DDR3 components with a single chip-select, claimed to be the world's first, have been introduced by I'M Intelligent Memory. The JEDEC specification JESD79-3 has always allowed an 8Gb density for DDR3 memory devices. While most DRAM manufacturers are waiting for a 2 x nm process to fit such high memory capacity into a single DRAM IC package, I’M has manufactured 8Gb DDR3 components utilising existing 30nm manufacturing technologies.

The I’M 8Gb components are 100% compatible with the JEDEC standard pinout, timing and row/column/bank addressing, providing the simplest path to higher density DDR3 upgrades. These devices allow for a new level of memory capacity without altering existing board-layouts or designs.

Orderable devices include a x8 (1Gx8) configuration in FBGA 78 ball package, a x16 (512Mx16) type in FBGA 96 ball package as well as a x32 (256Mx32) configuration in FBGA 136 ball package. In addition, I’M offers DDR3L low-voltage (1.35V) versions of these devices. The products are available in commercial and industrial temperature ranges.

Based on the 8Gb DDR3 components, I’M has also released 16GB DDR3 240 Pin unbuffered DIMMs (UDIMMs) and 204 Pin SO-DIMMs. These high-capacity memory modules are also available with a 72b width for ECC error correction.

The 8Gb components and 16GB modules have been verified to be compatible with processors and micro-controllers from AMD, Cavi-um, Freescale, Tilera and many others.

With the 8Gb DDR3 chips and high density DDR3 modules, I’M sees potential markets in embedded/industrial, networking and telecommunication applications, as well as PC, laptops, servers and microservers, allowing to reach previously unattainable memory capacities.