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STM's Serial EEPROM Families Now Available in 2 x 3mm MLP8 Packages

23rd March 2007

ES Admin

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STMicroelectronics has announced that all of its Serial EEPROM devices, from 2 to 64-Kbit density – and from both the SPI and I2C interface series – are now available in the tiny 2 x 3mm MLP8 package, compared to the predecessor 4 x 5mm S08N package, enabling significant space and cost savings for portable consumer and communications products.

ST claims to be the first in the market to offer a comprehensive ‘low-density’ serial EEPROM range in such a small package. The ultra-thin (0.6mm), fine-pitch, dual flat 2 x 3mm Micro Leadframe Package (MLP) delivers important improvements compared to other packages, and the families offer footprint compatibility throughout the range from 2 to 64-Kbit density.

The tiny memory chips, in the M24 (I2C bus interface) and M95 (SPI bus interface) families, operate over a wide supply-voltage range, from 1.8V to 5.5V, and are specified to function for more than one million Write cycles and to retain data for more than 40 years. They are ideal for compact consumer electronics applications, such as digital cameras, camcorders, MP3 players, remote controls and games consoles, as well as in communications products including cellphones, handsets, and Wi-Fi, Bluetooth and wireless-LAN cards.

All of the devices in the low-density MLP8 2x3 family, from 2 to 64 Kbit, are available in volume now, except for the 64-Kbit I2C variant, which will enter volume production in the second half of 2007. Samples of all the devices are available now.