Memory

Virtium ECC SODIMM Memory Modules Proven for High-Volume MicroServers

24th January 2013
ES Admin
0
Virtium today announced that the company’s ECC SODIMM memory modules are proven for use on high-volume MicroServers. Intel has validated Virtium’s ECC SODIMM modules on its Bordenville MicroServer platform, which paves the way for more mainstream applications to realize the advantages of ECC on a smaller form factor module.
Because MicroServers are optimized for smaller, lightweight scale-out of non-enterprise applications such as front-end web, content delivery nodes and low-end dedicated hosting devices, these applications require lower cost, reduced footprint memory module solutions.

“Virtium is committed to delivering innovative memory solutions that help our customers. Our ECC SODIMM modules have been successfully implemented in telecom, networking and embedded systems for many years, and now MicroServer platforms can cost-effectively leverage this proven memory module solution,” said Phan Hoang, vice president of R&D at Virtium. “Our embedded and industrial systems customers also benefit from better economies of scale due to broader adoption of this technology.”

Virtium is known as a memory solutions innovator, and has developed numerous industry firsts such as VLP and Blade VLP (ULP). The company was the also the first to introduce ECC SODIMM and SO-RDIMM products in 2006, and led its specification development through JEDEC. The expansion into more mainstream MicroServer applications demonstrates how DDR2, DDR3, DDR3L ECC SODIMM can serve as a cost-effective memory module alternative in higher volume system deployments.

Virtium’s full line of ECC SODIMM memory modules are available now in DDR2, DDR3, DDR3L, standard VLP and Blade VLP (ULP) form factors.

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