Die revisions provide new memory chip source

"With the introduction of a new B die version, we now have two sources for our 2Gb and 4Gb parts' silicon. This means our customers can be more confident than ever in our ability to deliver these devices despite shortages and price increases in the memory market."

The DDR architecture of Alliance Memory's 2Gb and 4Gb DDR3 and DDR3L SDRAMs allows them to achieve fast transfer rates of 1,600Mbps and clock rates of 800MHz. With minimal die shrinks, the devices provide reliable drop-in, pin-for-pin-compatible replacements for a number of similar solutions used in newer-generation microprocessors for networking, industrial, medical, telecom, and consumer applications - eliminating the need for costly redesigns and part requalification.

The 2Gb AS4C128M16D3B-12BCN and 4Gb AS4C256M16D3B-12BCN DDR3 SDRAMs operate from a single 1.5V (0.075V) power supply, while the 4Gb AS4C256M16D3LB-12BCN DDR3L SDRAM operates from a single 1.35V power supply. The devices offer a data mask for write control and are available with a commercial temperature range of 0-95°C. The 4Gb DDR3L SDRAM is also available in an industrial temperature range of -40 to 95°C.

The 2Gb DDR3 SDRAMs are internally configured as eight banks of 16M word x 16 bits, while the 4Gb DDR3 and DDR3L SDRAMs are configured as eight banks of 32M word x 16 bits. All devices support sequential and interleave burst types with read or write burst lengths of four or eight. An auto pre-charge function provides a self-timed row pre-charge initiated at the end of the burst sequence. Easy-to-use refresh functions include auto- or self-refresh. RoHS-compliant, the devices are lead (Pb)- and halogen-free.