Anti-vibration fill now available in RAM modules
Cervoz offers value-added technology, Anti-Vibration Fill, to enhance the robustness of their DRAM modules. The new technology is available exclusively from Display Solutions in the UK. In real-world industrial computing applications, embedded devices are installed in harsh environments with constant shock or vibrations. The RAM modules inside these devices may be vulnerable to these impacts, causing poor contact and connection.
The RAM modules can be protected by filling epoxy resin between the edges of PCB and RAM chips, therefore preventing the solder joints from coming loose.
Commenting on the announcement, Brendan O’Reilly, Commercial Manager at Display Solutions said: ‘This value-added technology from Cervoz provides an effective option to protect RAM modules, making their range ideal for a variety of critical applications including in-vehicle computing, machine automation and military.’
The standard series offers a temperature range of 0°C~70°C and the wide temperature series can operate from -40°C~85°C.
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