Memory

This video from Microchip will show how you can setup Microchip’s PIC24FJ1024GB610 family’s dual-partition flash with live update capability for a typical application using the MPLAB X Tool chain.

A new 4-Bay Hard Drive Eraser for 2.5” or 3.5” SATA Drives has been released by StarTech.com which erases four SATA drives simultaneously. This drive eraser offers an efficient way for users to securely erase sensitive data and information from hard drives in batches, ultimately saving time. The 4-bay drive eraser is made for the IT professional and technician, but also the tech minded business professional who wants to quic...

At CES 2018, Toshiba Memory Europe announced the launch of the RC100 series - a new line of NVMe (NVM Express) M.2 solid state drives (SSDs) for the retail, e-tail, system integrator, and channel markets. The new RC100 series features a powerful yet cost-effective design, making NVMe storage accessible to everyone.

Cypress Semiconductor has announced the inclusion of its high bandwidth HyperBus 8-bit serial memory interface into the new eXpanded SPI (xSPI) electrical interface standard from the JEDEC Solid State Technology Association. The xSPI standard defines requirements for the compatibility of high performance eight times serial interfaces, enabling controller and chipset manufacturers to design a universal memory controller.

Alliance Memory has announced that it has expanded its high speed CMOS DDR3 and low voltage DDR3L SDRAMs with new 512Mb 8 times and 16 times devices in the 78-ball and 96-ball FBGA packages, respectively. Featuring a DDR architecture, the SDRAMs provide fast transfer rates of 1,600Mbps and clock rates of 800MHz.

Cypress Semiconductor has announced that MikroElektronika (MikroE), an embedded systems retailer, has selected Cypress' 4Mb serial Ferroelectric Random Access Memory (F-RAM) to be included on its newest click board with a mikroBUS socket. The FRAM 2 click board is a compact, plug-and-play solution designed to evaluate the data logging and processing capabilities of Cypress F-RAMs, and the board enables faster prototyping and development of I...

A research institute of CEA Tech, Leti, demonstrated significant improvements in the field of memory systems at IEDM 2017. These improvements included reconfiguring Static Random-Access Memory (SRAM) into Content-Addressable Memory (CAM), improving non-volatile crossbar memories and using advanced Tunnel Field-Effect Transistors (TFET).

  The AL15SE series HDD has been announced by Toshiba Electronics Europe, its next-gen of 10,500rpm enterprise performance hard disk drives for mission-critical servers and storage. The new drive series boasts a 2,400GB capacity model – a 33% capacity increase over Toshiba’s AL14SE generation and Toshiba’s largest capacity ever for a 10,500rpm HDD.

Sample shipments of Toshiba Memory Europe's embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1 have begun. The new products meet AEC-Q100 Grade 2 requirements, support the wide temperature range of -40 to 105°C, and offer the enhanced reliability capabilities that are required by increasingly complex automotive applications.

  The XG5 lineup of NVMe solid state drives (SSDs) from Toshiba Memory Europe that are based on its 64-layer, 3D BiCS FLASH memory has been expanded. The new XG5-P is a premium sub-series that doubles the capacity and is tuned to improve full access range random read/write performance by up to 55% over standard XG5 SSDs.