Memory

Research institute at CEA Tech, Leti, and CMP, a service organisation that provides prototyping and low volume production of ICs and MEMS, have announced the multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base wafer platform.

A new way of arranging advanced computer components called memristors on a chip could enable them to be used for general computing, which could cut energy consumption by a factor of 100. This would improve performance in low power environments such as smartphones or make for more efficient supercomputers, says a University of Michigan researcher.

  Win a Microchip Serial Memory Single-Wire EEPROM evaluation kit (DM160232). The serial memory single-wire evaluation kit is an easy to use interactive user tool, which demonstrates functionality and low power operation of the AT21CS series of serial EEPROM devices.

It has been announced that Pentek are introducing the Talon RTX 25xx series, a high performance small form factor (SFF) recorder product line for extreme operating environments. Optimised for SWaP (size, weight and power), the rugged sealed ½ ATR recorders are available with multiple input options and can hold up to 30.7tB of removable SSD storage. 

The most dense solid-state memory ever created could soon exceed the capabilities of current computer storage devices by 1,000 times, thanks to a new technique scientists at the University of Alberta have perfected. “Essentially, you can take all 45 million songs on iTunes and store them on the surface of one quarter,” said Roshan Achal, PhD student in Department of Physics and lead author on the new research. “Five years a...

Supplier of processor solutions for demanding environments, Concurrent Technologies, has partnered with Lynx Software Technologies to provide solutions for applications requiring a secure virtualised environment. 

Toshiba Memory Europe has announced that it has developed a prototype sample of a 96-layer BiCS FLASH, memory device using its proprietary 3D flash quad level cell (QLC) technology that boosts single-chip memory capacity. QLC technology is pushing the bit count for data per memory cell from three to four, expanding capacity. The new product achieves the industry's maximum capacity of 1.33Tb for a single chip and was jointly developed with We...

It has been announced that Swissbit will be exhibiting its latest memory innovations at the Flash Memory Summit 2018 in Santa Clara, California, 7th to 9th August 2018. At booth #419, Swissbit will launch its latest 3D-NAND-based memory solutions for industrial temperature grades including the PCIe M.2-Module N-10m2 and a new 2.5” SATA SSD. 

Innovative non-volatile memory solutions, such as the embedded memories for microcontrollers and Systems on a Chip (SoC), developed by Ferroelectric Memory (FMC), must satisfy increasingly demanding requirements in terms of scalability, number of write cycles and duration of data retention even in extreme environmental conditions.

IC Insights will release its 200+ page Mid-Year Update to the 2018 McClean Report later this month. The Mid-Year Update revises IC Insights’ worldwide economic and IC industry forecasts through 2022 that were originally published in The 2018 McClean Report issued in January of this year.