Memory

Alphawave Semi, a global pioneer in high-speed connectivity and compute silicon for the world’s technology infrastructure, has announced a 9.2Gbps HBM3E sub-system (PHY + Controller IP) silicon platform.

Alphawave Semi has unveiled a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform.

Infineon has announced the availability of the industry’s first radiation-hardened (rad hard) 1 and 2Mb parallel interface ferroelectric RAM (F-RAM) nonvolatile memory devices.

Imec, a global research and innovation hub in nanoelectronics and digital technologies, and ASML, a pioneering lithography supplier to the semiconductor industry, have announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by ASML and imec.

Cervoz has unveiled its new U.3 enterprise SSD for big data applications and modern enterprise.

Silicon Motion Technology Corporation has launched the SM2322. This is a fast, single-chip solution for external portable SSDs, offering high performance, low power consumption, and cost-effectiveness.

One of the big challenges with data centres is amount of power that they consume. This is being further exacerbated by the increasing use of AI in the form of Large Language Models.

Macronix International, an integrated device manufacturer in the non-volatile memory (NVM) sector, has announced that its ArmorFlash memory is now compatible with the new Renesas RA8M1 Arm Cortex-M85 core-based microcontrollers (MCUs), offering advanced levels of data security.

CUI Devices’ Interconnect Group has announced the addition of memory card connectors to its connectors product portfolio.

Alliance Memory announces that it has expanded its offering of high-speed CMOS mobile low-power SDRAMs with new 16Gb and 32Gb LPDDR4X devices that combine low power ratings with increased clock speeds and data rates in the 200-ball FBGA package.