Memory

Micron Technology has announced its complete high-density automotive AEC-Q100 Grade 1 (+125°C) qualified NOR flash portfolio to enable next-generation, ultra-high temperature automotive solutions with fast boot and instant-on performance, along with direct execute-in-place (XiP) operation. 

Micron Technology has introduced the industry’s first 1TB automotive and industrial grade PCIe NVMe solid state drive (SSD) in BGA and 22x30mm M.2 form factors at Electronica 2018. Based on 64-layer triple-level cell (TLC) 3D NAND technology, the new Micron 2100 series of NVMe SSDs is designed for next-generation autonomous cars and the industrial internet of things (IIoT).

At the electronica trade fair, Cypress Semiconductor introduced a nonvolatile data-logging solution with ultra-low power consumption. This solution is ideal for the latest-generation portable medical and wearable devices and other IoT applications that demand nonvolatile memories to continuously log an increasing amount of user and sensor data while using as little power as possible. 

The portfolio of solid state drive (SSD) ArmourDrive modules from Greenliant is growing with the introduction of 87 PX Series SATA M.2 products. Designed for embedded systems requiring removable data storage that can operate in extreme environments, industrial temperature (-40 to +85°C), SATA M.2 ArmourDrive SSDs are built in the widely used 2280 form factor. 

The broader deployment of its NVMe hardware RAID solutions with new capabilities has been announced by Broadcom. Broadcom is continuing its commitment to invest in Tri-Mode product development, which includes the development of new industry standards, leading the ecosystem enablement, and SAS/SATA/NVMe device compatibility testing.

Electronic Specifier had a chance to meet with memory solutions provider Micron at the recent electronica exhibition in Munich. The company, with headquarters in Boise, Idaho, specialises in DRAM, NAND Flash, NOR Flash, Hybrid memory solutions and Solid State Drives (SSDs), which have applications in a broad line of industries such as automotive, consumer, embedded, industrial, mobile, networking and financial.

The embedded solutions provider, Cypress Semiconductor, has announced it has embedded compute capabilities into its next-generation memory platform to address the growing demand for trusted intelligence and fail-safe storage in applications such as Advanced Driver Assistance Systems (ADAS) and smart factories. 

It has been announced that Alliance Memory has extended its offering of 512Mb high-speed CMOS SDRAMs with new monolithic 64Mx8 (AS4C64M8SC-7TIN) and 32Mx16 (AS4C32M16SC-7TIN) devices in the 54-pin 400-mil plastic package, and a 16Mx32 (AS4C16M32SC-7TIN) device in the 86-pin TSOP II package. The new SDRAMs are among the products Alliance Memory will feature next week at electronica 2018 in Stand B5 526.

Industrial storage and memory provider, Apacer, will participate in the electronica Expo 2018, showcasing the latest industrial products and technologies which include industrial grade 3D TLC NAND, TCG Opal 2.0, CorePower and rugged memory XR-DIMM solutions. Apacer will focus on six applications including IoT, server & networking, transportation, defence, gaming and healthcare. 

  With a focused feature set and compact package options, STMicroelectronics’ STM32L412 and STM32L422 microcontrollers (MCUs) aim to bring ultra-low power technologies and high performance to budget-conscious consumer, industrial, and medical applications.