Memory

With mobile product shipments, dominated by smartphones, continuing to account for a significant amount of the non-volatile memory (NVM) market, suppliers and standardisation organisations are working hard to ensure that next-generation NVMs keep up with the demands placed upon them.  Author: Axel Stoermann, Toshiba Memory Europe 

At embedded world 2019, Toshiba Memory Europe will be exhibiting, where they will highlight the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. Toshiba will also demonstrate two new solid state drives (SSDs). All of these innovations are based on their 96-layer, BiCS FLASH 3D flash memory.

  Manufacturer of industrial-grade flash memory solutions, Swissbit, will be highlighting its security solutions at embedded world, which will be taking place from 26th to 28th February 2019 in Nuremberg, Germany, in Hall 1 Booth # 1-534.

Toshiba has started sampling the 128GB version of the Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new line-up utilises the company’s 96-layer BiCS FLASH 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB. With high speed read/write performance and low power consumption, the new devices are suitable for applications such as mobile devices, smartphones, tablets, and augmented/virtua...

Memory and storage solutions provider, Micron Technology, has announced that its GDDR6 memory, Micron's fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix's next-generation stand-alone FPGA products built on TSMC seven nanometre process technology.

The introduction of the fourth generation of Toshiba Memory’s single package ball grid array (BGA) solid state drive (SSD) BG4 series was announced at CES 2019. Toshiba Memory’s new line-up of ultra-compact NVMe SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server boot in data centres.

With the 660p series Intel is launching the first SSDs with QLC 3D-NAND-architecture on the market. They are characterised by a very high storage density and large capacities. The solid state drives in M.2 form factor with PCIe and NVMe are available with 512GB, 1TB and 2TB storage space from Rutronik UK.

A new series of enterprise capacity hard disk drives has been announced by Toshiba Electronics Europe with the MG08 Series. The series is a large capacity 16TB Conventional Magnetic Recording (CMR) HDD. The product has 33% more capacity than today’s widely adopted 12TB drives, and 14% more capacity than prior 14TB models.

Greatly reduced lead times for its DRAMs with -40°C to +105°C automotive temperature ratings have been announced by Alliance Memory. Responding to customer demand, the company now holds many parts in finished goods stock and in addition can promise lead times of just six weeks for its most popular automotive temperature range products.

Global broad-line stocking distributor Rutronik, has announced that Swissbit’s high-performance Industrial SD and microSD Memory Cards Series are now available. The SD and microSD Memory Cards are designed and tested to withstand extreme environmental conditions, and deliver sustained high performance and endurance in a variety of applications.