Memory

Micron Technology has announced it began sampling the industry’s first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The uMCP provides high-density and low-power storage designed to fit on slim and compact midrange smartphone designs.

Marvell has announced that it is working with leading SSD vendor KIOXIA and original design manufacturers (ODMs) Foxconn-Ingrasys and Accton to bring its Ethernet Bunch of Flash (EBOF) technology solutions for Ethernet storage to market. As data growth continues to soar, data centres are faced with demand for greater storage bandwidth and capacity as well as lower latency.

Winbond Electronics Corporation and Karamba Security have announced secure flash memory chips with integrated runtime integrity for automotive ECUs and IoT connected consumer, industrial devices and supply chain security.

The data that computers across numerous sectors are collecting and processing needs to be stored, a demand that continues to push storage costs higher. Cost is a pain point in the consumer electronics sector, and manufacturers of smartphones and laptops want to see storage costs decrease. However, that decrease can’t come at the expense of the safety and reliability that both commercial and industrial enterprise servers require. 

Apacer has announces the full-scale production of 32GB DDR4 industrial-grade memory. This is now available to global first-line SD-WAN (Software-Defined WAN), and virtual router vCPE (Virtualised Customer Premises Equipment) customers. 

The family of certified TrustME Secure Flash memory chips from Winbond Electronics has been extended with the W77Q series which targets IoT and smart connected consumer and industrial devices.

SMART Modular Technologies has announced its lineup of DDR4-3200 32GB Low Profile industrial Mini-DIMMs. SMART has several new 32GB Mini-DIMMs which include ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC options to meet a wide range of use cases. 

KIOXIA Europe (formerly Toshiba Memory Europe) has announced that it has started sampling Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices.

Alliance Memory has confirmed it will be attending embedded world 2020 in Nuremberg (February 25-27) to exhibit its SRAMs, DRAMs and flash memory ICs for legacy and new designs.

NanoLock Security has announced it is joining with Adesto Technologies to collaborate on flash-based embedded security and management solutions for low density flash memory devices used in products such as smart meters, sensors and controllers in smart energy, water utilities, industrial facilities and more.