Memory

Blueshift Memory has announced the availability of a RISC-V processor reference design that addresses the twin problems facing today’s computing industry: the Memory Wall and the Energy Wall.

Winbond Electronics, a global supplier of semiconductor memory solutions, announces the enhanced LPDDR4/4X DRAM products, specifically designed for the latest generation of automotive applications. These solutions offer significant advancements in power efficiency, performance, and carbon reduction.

ATEK Access Technologies announces the release of the Mini-Bar series, the latest addition to its Datakey brand of rugged portable memory products. Consisting of portable memory tokens and mating receptacles, the Mini-Bar series provides embedded systems designers with a robust memory key that can be used as a credential for access control or to store and transfer data. 

AMD announced the AMD Versal Premium Series Gen 2, an adaptive SoC platform designed to deliver the highest levels of system acceleration for a wide range of workloads.

In today’s industrial landscape, seamless device communication is key. The Controller Area Network (CAN) Bus – a reliable protocol initially developed for vehicles – now enables quick, decentralised data transfer across sectors without central control.

Alliance Memory has announced the expansion of its Serial NOR Flash product line with the introduction of three new 3.3 V families with density of 128Mb, 256Mb, and 512Mb.

Greenliant will show its new high endurance EX Series NVMe ArmourDrive M.2 2242/2280 and NANDrive ball grid array (BGA) solid state drives (SSDs) at electronica 2024, Munich, Germany, November 12-15, in hall C4, booth 359.

Alliance Memory has announced that it has expanded its portfolio of CMOS DDR4 SDRAMs with six new 8Gb, 16Gb, and 32Gb devices in 78-ball FBGA and 96-ball FBGA packages.

KIOXIA Europe GmbH, announces that it has begun mass production of the industry’s first[1] Universal Flash Storage (UFS)[2] Ver. 4.0 embedded flash memory devices with four-bit-per-cell, quadruple-level cell (QLC) technology.

From January 2025, MEMPHIS Electronic will hand over its private-label DRAM modules to Intelligent Memory.