Memory

Mouser Electronics has signed a global distribution agreement with Hyperstone, a NAND flash memory controller company enabling safe, reliable and secure storage systems.

Winbond Electronics has revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest in edge AI computing from Flex Logix for demanding Artificial Intelligence (AI) applications such as object recognition.

Apacer has announced mass production of a full range of industrial-grade DDR4-3200 wide-temperature memory modules. They use Samsung’s original wide-temperature grade chips to support cutting-edge platforms including AMD’s Ryzen Embedded V2000 processor and Intel’s Tiger Lake and Elkhart Lake.

In stock now at distributor Mouser Electronics, Inc. are the 2210 QLC Solid-State Drives (SSDs) from Micron.

Data centre technology, whether for public clouds, private clouds or enterprise data centres, has just taken a tremendous step forward with significant impact for AI, ML and database storage thanks to new technology in Excelero’s NVMesh software. By Kirill Shoikhet, Excelero CTO

Winbond Electronics has announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform. GoAI 2.0 is a complete, new hardware and software solution for machine learning applications.

Micron Technology has announced volume shipment of 1α (1-alpha) node DRAM products built using advanced DRAM process technology and offering major improvements in bit density, power and performance. This milestone reinforces Micron’s competitive strength and complements its recent innovations in graphics memory and 176-layer NAND.

Innodisk’s 96-layer 3D NAND flash product lineup is now being shipped by distributor New Yorker Electronics. It meets demanding industrial applications.

Winbond Electronics has announced that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved another success in high bandwidth memory with Tsing Micro latest artificial intelligence (AI) system-on-chip (SoC).

Alliance Memory has added to its offering of high-speed CMOS mobile low-power SDRAMs with new LPDDR4 devices featuring on-chip ECC.