Memory

WPG EMEA has signed an agreement with memory supplier Alliance Memory to sell and support its full range of products throughout EMEA.

Rutronik is stocking the current generation of ATP DRAM modules, the DDR4. The data transfer rate of up to 3,200 MT/s ensures an increase in the maximum possible clock speed.

CEA-Leti has reported the world’s-first demonstration of 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node that advances this energy-saving technology closer to commercialisation. The breakthrough includes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm², and solder reflow compatibility for the first time for this type of memory.

Innodisk has announced its EGPL-T101 M.2 2280 10GbE LAN module, which they claim is the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility.

Bob O'Donnell, President and Chief Analyst of TECHnalysis Research, LLC for Lattice Semiconductor, discusses the importance that memory technologies, particularly FPGAs, have in embedded designs.

Latest industrial grade 3D NAND e.MMC series offers robust memory solution

Mouser Electronics has bolstered its line-up of memory products with the addition of ferroelectric random access memory (FRAM) and large-density resistive random access memory (ReRAM) products from Fujitsu Semiconductor Memory Solution.

KIOXIA EDSFF E1.S SSDs now available for hyperscale data centers

Renesas, a supplier of advanced semiconductor solutions, has introduced what it claims is the industry’s first industrial temperature DDR5 (5RCD0148H) and DDR4 (4RCD0232K) registered clock drivers (RCDs).

To facilitate chip innovation and enable designers to quickly achieve silicon success of complex high-performance computing (HPC) and mobile SoCs, Synopsys, today announced a collaboration with TSMC to develop a broad portfolio of Synopsys DesignWare Interface and Foundation IP on the TSMC N4P process.