Mesh networking modules streamline secure IoT product design

The new MGM210x and BGM210x Series 2 modules support leading mesh protocols (Zigbee, Thread and Bluetooth mesh), Bluetooth Low Energy and multiprotocol connectivity. They offer a one-stop wireless solution to improve mesh network performance for line-powered IoT systems ranging from smart LED lighting to home and industrial automation.

Time to market is a key challenge and a potential competitive advantage for IoT product developers. Silicon Labs’ pre-certified xGM210x modules help reduce R&D cycles related to RF design and protocol optimisation, allowing developers to focus on their end applications. Pre-certified for North America, Europe, Korea and Japan, the modules minimise the time, cost and risk factors related to global wireless certifications. xGM210x modules make it possible to accelerate time to market by several months.

The new modules are based on Silicon Labs’ Wireless Gecko Series 2 platform featuring industry-leading RF performance, a powerful Arm Cortex-M33 processor, best-in-class software stacks, a dedicated security core and a +125°C temperature rating suited for harsh environmental conditions.

xGM210x modules are engineered to optimise the performance of resource-constrained IoT products without requiring functionality tradeoffs impacting communication reliability, product security or field upgradability. An integrated RF power amplifier also makes the modules ideal for long-range Bluetooth Low Energy applications requiring hundreds of meters of line-of-sight connectivity.

“This new portfolio of application-optimised modules provides a fast and easy wireless on-ramp to mesh networking, helping IoT developers get their connected products to market ahead of the competition while preserving their investments in tools and software,” said Matt Saunders, Vice President of Marketing and Applications, IoT Products, Silicon Labs.

“Our fully integrated module design, comprehensive wireless stacks, state-of-the-art security and powerful development tools help our customers add wireless connectivity and mesh capabilities to IoT applications with the lowest R&D investment, saving months of engineering effort and testing.”

The Series 2 module portfolio’s initial families include the industry’s first pre-certified wireless modules optimised for LED light bulbs and a versatile printed-circuit board (PCB) form-factor module designed to meet the needs of a broad range of ultra-small IoT product designs.

xGM210L modules are designed to meet the unique performance, environmental, reliability and cost needs of smart LED lighting. The modules combine a custom form factor to ease mounting inside LED bulb housings, PCB trace antenna to maximise wireless range, high temperature ratings, extensive global regulatory certifications and low active power consumption, delivering the perfect wireless solution for cost-sensitive, high-volume smart LED lightbulbs.

xGM210P modules feature a PCB form factor, integrated chip antenna and minimal clearance areas for mechanics, simplifying space-constrained IoT designs including smart lighting, HVAC, building and factory automation systems.