First integrated control MMIC for commercial radar

The X-Band Core Chip (MAMF-011015) is a highly integrated solution setting new standards for size, weight, and performance enabling the next generation of radar system design. Building on a legacy of successful product design across the entire frequency range, the X-Band Core Chip integrates a CMOS logic driver with a GaAs Transmit/Receive MMIC within a single QFN package. The surface mount 7x7mm plastic package offers a cost-effective, easy to implement solution. The device’s versatility and flexibility make it ideal for weather, wildfire and related commercial radar applications.

Paul Beasly, Product Manager, comments: “The X-Band Core Chip plays a pivotal role in next generation radar chip-sets for commercial applications. The device offers a unique combination of QFN surface-mount packaging with advanced MMIC design integration to provide a simple and effective solution for next generation X-Band weather radar systems.”

The X-Band Core Chip development is a product of a joint investment between MACOM and FIRST RF Corporation to support new weather radar programs such as the Collaborative Adaptive Sensing of the Atmosphere Weather Radar Program. CASA is a multi-sector partnership among academia, industry, and government - dedicated to engineering revolutionary weather-sensing networks. These innovative networks save lives and property by detecting the region of the lower atmosphere currently below conventional radar range - mapping storms, winds, rain, temperature, humidity, and the flow of airborne hazards.

“MACOM has a rich and successful history supporting the global radar market, and we are pleased to be working very closely with an industry leader on the CASA Weather Radar Program. The X-Band Core Chip provides us with an integrated, surface mount solution that allows for high-yield automated assembly, smaller footprint design and improved reliability – enhancements which empower us to quickly identify critical weather systems, to protect people and property, and mitigate damage,” commented Theresa Boone, President, FIRST RF Corporation.

The packaged device comprises of a common leg circuit which includes digital attenuators, phase shifters, a low noise receive chain, and a transmit driver amplifier, as well as a CMOS logic driver. This integrated circuit utilizes MACOM’s advanced 0.25um PHEMT process, which has been optimized for high power and low noise amplifiers, passive and control components and allows for a high level of integration on a single MMIC.

The table below outlines typical performance:

Visit MACOM at Booth #169 at European Microwave Week in Nuremberg Germany, 8-10, October, to find out more about the X-Band Core Chip and how you can order samples today