Smiths expands attenuator range

This compact, high-reliability product is well-suited for space and defence applications and is easy to implement. The TSX WB2 Series meets the stringent MIL-PRF-55342 qualification standards and delivers exceptional broadband performance up to 50 GHz.

It offers enhanced power handling capabilities in a small 0404 wire bondable package, providing better coverage than traditional components while optimising return loss across multiple frequency ranges. This enables customers to utilise a single chip for various applications, reducing the Bill of Material (BOM) item count and ownership costs.

The TSX WB2 series is available for order with group A, B, or C testing based on MIL-PRF-55342 standards, and qualification data is provided with product delivery to ensure programme assurance.

“The TSX Wire Bondable series is a cost-effective wire bondable attenuator solution, ”commented Tullio Panerello, Vice President and General Manager of the Fibre Optics and RF Components Business Unit at Smiths Interconnect. "It provides another chip attenuator option with excellent attenuation performance, compact in size and provides MIL spec test data for program assurance."

Designed for mission-critical applications, this chip attenuator supports 1 to 3 watts of power handling and offers various attenuation values. The robust all-thin-film process technology on an alumina nitride substrate ensures suitability for harsh environments, such as those found in space and defence applications.