MagnaChip and Peregrine Announce Volume Ramp of STeP5 UltraCMOS™ RF Switch Products

UltraCMOS™ technology utilizes a sapphire substrate, enabling high levels of monolithic integration
which results in smaller die, higher yields and fewer external components when compared to
compound semiconductor processes such as GaAS.

Peregrine and MagnaChip have been engaged in the transfer of the patented UltraCMOS™ technology
since mid-2007 and have implemented Peregrine’s STeP3 and STeP4 process generations at
MagnaChip’s 0.35µm manufacturing facility located in Cheongju, South Korea. MagnaChip has now
successfully completed the final qualification phase in the transfer of STeP5 process generation and
has ramped to high-volume production.

TJ Lee, senior vice president and general manager of MagnaChip’s corporate and SMS engineering
commented, “We are very pleased to announce MagnaChip’s production ramp of Peregrine’s latest
STeP5 UltraCMOS RF switch products. The continued introduction of these robust and unique RFIC
solutions are a direct result of the combined expertise – MagnaChip’s manufacturing services and
Peregrine’s technology and design engineering -- and of the long-term strategic roadmap we have
outlined.”
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