Radio chipset lowers complexity & time-to-market for ISM designs

IPDiA's companion chips, the ASPICS320, leverage the company's advanced Passive Integrated Connective Substrate (PICS) technology, which enables devices such as baluns, couplers, splitters, filters and diplexers/duplexers to be integrated densely on a silicon substrate. The result is a saving of up to 80% in PCB area compared with discrete SMD solutions.

With three variants covering the 868MHz to 915MHz RF range, the ASPICS320 puts a highly symmetric VCO tank, a loop filter with optimal bandwidth, a high matching network, high RF rejection and efficient decoupling onto a single silicon die; it replaces 13 key components, including the SAW function, in a package just 2.05 x 5.5mm in footprint.

“IPDiA ASPICS are fully in-line with our strategy to bring the best products into overall solutions to our customers in different RF markets” said Jon Ellis, VP of Marketing Avnet-Memec EMEA “By strongly simplifying RF designs with the Semtech/IPDiA chip-set, we are able to offer a highly reliable solution early in the design phase, which will shorten development cycle times and bring the most competitive products to market faster.”

As well as improved performance in a compact two-chip solution, the devices offer designers the additional advantages of reduced bill of materials and lower complexity. A reference design, evaluation boards, detailed application notes and pan-European technical support are available through Avnet Memec to further simplify design-in, accelerate development and lower time-to-market.

“Avnet Memec provides good design chain services to an expansive portfolio of customers in the European electronics markets and have a lot of experience with Semtech’s RF devices” said Laurent Dubos, Director, Sales & Marketing for IPDiA, With strong logistics, design support orientation and excellent customer service, Avnet Memec will bring quick and easy assistance during the whole design cycle, from initial evaluation up to production in volume”.

Offered in compact WL CSP packages, the IPDiA devices are reflow compatible for standard production processes and are available in standard tape-and-reel format for volume manufacture.