Frequency

ICEpower A/S has introduced the latest addition to its lineup – the ICEpower ICC5 audio integrated circuit.

Fairview Microwave, an Infinite Electronics brand and a provider of on-demand RF, microwave, and millimetre-wave components, has introduced a new series of 5G amplifiers.

Pasternack has unveiled its sophisticated array of rubberduck and whip-style antennas. These antennas are designed to improve wireless applications, showcasing Pasternack's commitment to developing high-efficiency solutions of high quality.

Picocom, the 5G Open RAN baseband semiconductor and software specialist, has announced that it has launched PC805, a new system-on-chip (SoC) optimised for 5G small cell Open RAN radio units (O-RUs).

With the launch of devices based on the new Wi-Fi 7 communications standard, there is already a growing demand for test instrumentation that can evaluate them.

Samtec, the service provider for the connector industry, has enhanced its open-pin-field arrays to simultaneously run analog, digital, and power signals.

Saelig has introduced the Aaronia IsoLOG 3D Mobile PRO Three-Axis Testing Antennas for RF measurements up to 8GHz.

The Chomerics Division of Parker Hannifin is introducing its CHO-MUTE 9009 microwave absorber material. Comprising a silicone elastomer matrix with a carbon filler, the material offers RF absorption performance at a high frequency range.

Availability and full design support capabilities for a new RF front-end module from United Monolithic Semiconductors is announced by Richardson RFPD.

Ventec International Group will once again team up with partner Taiyo to promote the synergy between Ventec’s substrate materials and Taiyo solder masks, at Productronica 2023, Munich 14—17 November 2023 in Hall B3, Booth 242.