FPGAs deliver 50% PCB area savings

The non-volatile configuration of these two FPGA devices eliminates the need for external configuration memories. The introduction of the new packages extends Microsemi’s portfolio of true flash-based programmable logic devices, adding a variety of small form factor packages for both device families, including the FCS325 11mm x 11mm, VF256 14mm x 14mm, FCV484 19mm x 19mm and VQ144 22mm x 22mm.

Microsemi’s FPGAs inherently reduce board space, with the introduction of the the small form factor options further extending this advantage. For example, the SPI flash required to configure a 90K LE SRAM-based FPGA can consume approximately 100mm of additional board real estate, which is approximately the entire area the M2S090 device occupies in an 11x11 package. In addition to the up to 50% PCB savings, the new package solutions provide increased system reliability by reducing the number of interconnects when compared to competing FPGAs.

Designed for use in communications, military/defense, industrial automation, automotive and video/imaging markets, the new small form factor solutions address the industry’s increasing demand for smaller footprint solutions

“Increased customer demand for highly reliable, secure, and small footprint SoC FPGAs and FPGA solutions are the catalyst for delivering our newest mainstream FPGAs in a variety of small form factor solutions,” commented Tim Morin, director of marketing at Microsemi. “We are pleased to expand our mainstream FPGA portfolio and provide our customers with additional competitive advantages.”