Efinix's Ti375 samples: mainstream Edge intelligence unleashed

“With today’s proliferation and diversity of applications, there is an insatiable demand for high compute performance and low power in a footprint that can be deployed at the far edge,” said Efinix Co-Founder, CEO and President Sammy Cheung. “The Titanium family of FPGAs, particularly the Ti375, is unique in being able to satisfy these requirements and an absolute game changer.”

The Ti375 is manufactured in an advanced 16nm process node. Titanium FPGAs deliver performance and efficiency through high-density, low power, and high compute in small package footprints ranging from 35,000-to-1 million logic elements. Ti375, with a capacity of 375K logic elements, features:

• Quad-Core Hardened RISC-V block at over 1GHz with Linux capable MMU, FPU, and custom instruction capability
• Quad SerDes transceivers supporting up to 16Gbps raw data rates with multiple protocols, including PCIe 4.0, Ethernet SGMII, and Ethernet 10GBase-KR protocols, as well as PMA Direct mode
• Dual Embedded PCIe Gen4x4 controllers supporting root complex and end point with SRIOV (Single Root I/O Virtualization) and dual hardened LPDDR4/4X DRAM controllers for high bandwidth access to external memory

“The Titanium family of FPGAs has set a new value bar for us in the imaging marketplace. The power and performance points have allowed us to innovate and extend our leadership position with our camera platforms,” said Jan Hartmann, Managing Director of industrial camera manufacturer IDS Imaging Development Systems GmbH. “The Ti375 elevates that value bar once again, delivering high speed SerDes and compute capability in a small, low power footprint. Efinix continues to deliver against the promise of its revolutionary architecture.”

The Titanium Ti375 FPGA solution enables a wide variety of applications spanning machine vision, video bridges, automotive, and communications, to name a few.

“Our Titanium Ti375 makes custom silicon obsolete, making it ideal for the rapidly evolving models used in AI, and will be instrumental in delivering against the requirements for edge intelligence,” said Mark Oliver, Efinix Vice President of Marketing. “By delivering a unique power, performance, size combination, Ti375 will support edge AI from lab to production, and beyond.”

In conjunction with embedded world Exhibition & Conference kicking off on the 9^th April 2024 in Nuremberg, Germany, Efinix representatives will be conducting live demos of the Titanium Ti375 at booth 4-549 in Hall 4.