FPGAs

  Microsemi announced its RTG4 high-speed signal processing radiation-tolerant FPGAs have achieved MIL-STD-883 Class B qualification, meeting the industry’s standard for qualifying microelectronic devices suitable for use within aerospace and defense electronic systems.

Trenz Electronic’s FPGA System on Modules (SoMs) are currently available from Digi-Key Electronics, as part of a new global distribution agreement signed by the two companies. Trenz Electronic uses the latest technologies and components from top semiconductor companies to make the smallest form factor modules. In the event that an off-the shelf FPGA board will not fit the customer’s requirements, the design can be easil...

The availability of ECP5-5G-based IP and solutions has been announced by Lattice Semiconductor Corporation, which are part of the company’s ECP5 family of low power, small form factor connectivity FPGAs for industrial and communications applications. This product family enables seamless connectivity to ASICs and ASSPs in a wide array of applications.

Xilinx has announced that Baidu is utilising Xilinx FPGAs to accelerate machine learning applications in their data centres in China. The two companies are collaborating to further expand volume deployment of FPGA-based accelerated platforms.

An FPGA module with a high performance TCP/IP Offload Engine (TOE) chip for Gigabit Ethernet interfacing has been announced by Orange Tree Technologies - the ZestET2-J. The easy to use module provides simple access to very fast data rates over Gigabit Ethernet, without having to integrate complex networking hardware and software.

For integration into customers’ SoCs, Achronix has announced the availability of its Speedcore embedded FPGA (eFPGA) IP. Speedcore is designed for compute and network acceleration applications and is based on the same high-performance architecture that is in Achronix’s Speedster 22i FPGAs that have been shipping in production since 2013. 

BittWare announced at the October meet-up of the NMI FPGA Network the first customer shipments of two new PCIe boards based on Xilinx's 16nm Virtex UltraScale+ FPGAs. The XUPP3R is a 3/4-length PCIe board that supports PCIe Gen4 x8 or Gen3 x16 and offers four front panel QSFP28 cages, each supporting 4 lanes of up to 25 Gbps with support for 10/25/40/100 GbE.

Extended capability to XJTAG’s high-speed In-System Programming (ISP) technology, XJFlash, has been announced. For the first time, this brings the benefits of XJFlash to memory devices connected to the processor sub-system of dual ARM-Cortex-A9 based FPGAs.

RTG4 FPGAs integrate Microsemi’s 4th gen flash-based FPGA fabric and high-performance interfaces such as serialisation/deserialisation (SERDES) on a single chip while maintaining the resistance to radiation-induced configuration upsets in the harshest radiation environments, such as space flight (LEO, MEO, GEO, HEO, deep space); high altitude aviation, medical electronics, and nuclear power plant control.

New enhancements have been made to Microsemi’s imaging/video solution supporting the Mobile Industry Processor Interface (MIPI) camera serial interface (CSI-2). Customers can use the company’s low power, highly secure IGLOO 2 field programmable gate array (FPGA) and SmartFusion 2 system-on-chip (SoC) FPGA capabilities in CSI-2-based camera systems.