First combined multi-touch & 3D-gesture modules

5th January 2016

Nat Bowers

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Microchip Technology and Silicon Integrated Systems (SiS) are partnering to provide customers with complete Projected-CAPacitive (PCAP) touch and 3D-gesture interface modules, which will lead to faster development and lower costs. The modules will make it easier to design multi-touch and 3D gesture displays with Microchip’s award-winning GestIC technology, which offers a hand tracking range of up to 20cm from the display surface.

Hand gestures are universal, hygienic and easy to learn. In addition, they enhance safety by reducing the need for precise hand-eye coordination.

Microchip developed the GestIC technology so that it can be readily combined with multi-touch PCAP controllers. It is the lowest-cost 3D gesture technology available on the market. In addition, GestIC sensors are constructed with standard materials and production methods, such as Indium Tin Oxide (ITO), metal mesh and conductive ink on glass or foil. These new modules from SiS are the world’s first to integrate 2D PCAP and 3D gesture technologies, providing a complete display solution. SiS has 30 years of experience and expertise in PC chipset products, eMMC, eMCP and PCAP touch solutions. Through this partnership with Microchip, SiS will act as an electronic developer and also provide sensor integration. The resulting modules will allow faster time to market for a broad range of designs, such as those in the automotive and consumer industries.

Dr. Roland Aubauer, Director, HMI Division, Microchip, commented: “We are excited to be partnering with SiS, in order to meet the growing demand for 3D control displays in the consumer, automotive, home-automation and IoT markets. Microchip is committed to furthering the innovation in human-interface technologies and SiS’s modules will ultimately allow our customers to integrate these two interface technologies into their applications faster. With this partnership, the next dimension of intuitive, gesture-based user interfaces is now available for a broad range of end products.”

"SiS is honoured to have the opportunity to partner with a world-class company such as Microchip. We are thrilled to have the ability to introduce the very first 2D/3D combination solution to the world. By partnering with Microchip, we foresee a huge increase in demand and market share for these new products. We are committed to continually introducing innovative, intuitive and creative technology to the world, and this partnership is a prime example," added Jonathan Shyi, President, SiS.

SiS modules with Microchip’s GestIC technology will be demonstrated at Microchip’s CES Booth MP25656 in Las Vegas, from 6th to 9th January, 2016.