Design

Witech Introducing FL6410 - The Android Development Kit

2nd March 2011
ES Admin
0
“In the year of 2010 we have been proud of our OK6410, in the coming 2011 we are getting even more proud, with the introduction of FL6410 - the Android development kit!”
As a leading manufacturer of ARM9 & ARM11 embedded development system, Witech never stopped pursuing perfection with their products. And now the flower just blossomed: by the first week of 2011 Witech is going to release their Android development kit - FL6410. We do believe that the FL6410 is the perfection for Android-based smart-phones and tablet PCs, let’s see what it has:



The Capable Hardware Support

• CPU: Samsung S3C6410 micro-controller, peak frequency @ 667MHz;

• 256MByte mDDR RAM and 1GByte NAND Flash provide you enough space for storage and processing capacity;

• Reserved high-capacity MoviNAND interface; Multi-Channel audio IO and GSM interface making up the perfect phone solution;

• Complete power management supporting sleep function;

• 1.3 / 3.0MPixels CMOS camera support;

• LCD interface supporting 4.3” and 7” LCD Touch Screen;

• RS232, RS485, CAN, SPI, AV-In, TV-out, CVBS interfaces for industry / home applications;

• Android-oriented keypad;

• Android system supporting WIFI, Ethernet, USB ADB, GPS, GRPS/GSM, camera, 3G



The Most Complete Android Support



• Linux-2.6.28 Kernel

• Ready-to-go Android 2.1 system

• Complete Android development environment

• Complete development documentation

• ADT plug-in

• Drivers for touch screen, keyboard, audio, video, SD card, WIFI, Ethernet, Camera, GSM/GPRS, 2D hardware acceleration, GPS, USB ADB





The FL6410-CORE

Measuring 60x60x2.8mm only, the stamp-shaped core board is actually the “core” of the board. The core board includes every key components of the FL6410 such as the CPU, RAM, Flash, audio, ethernet and etc., and leads out most signals from the S3C6410 MCU. Once programed, the core board can be detached from the base board and inserted like a big chip into customers’ own application and works as thecg unit of the application.

The FL6410-CORE features:







• Dimensions: 60 x 60 x 2.8 mm, 8 layers PCB;

• Samsung ARM11 S3C6410 MCU, ARM1176JZF-S, peak frequency reaches up to 800MHz;

• 256MByte MoblieDDR, 266MHz;

• 1GByte NAND Flash;

• MoviNAND Flash interface supporting up to 8GByte MoviNAND Flash);

• Audio I/O: WM9713 chips;

• 100M Ethernet, DM9000 chips;

• 170pin connector (QFP package) introducing most of the signals from S3C6410;

• Supporting Wince 6.0, Linux2.6 and Android 2.1;

• Power supply: 3.7V - 6.5V; Working Temperature: 0 to +70 Celsius;

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier