TouchNetix expand aXiom product offering with BGA package
Building on its aXiom product family offering, TouchNetix announces the introduction of ball grid array packaging (BGA) for its largest aXiom chip, the AX198A.
The reduced footprint of the BGA package allows for smaller PCBs which reduces cost and overall size of the solution.
This package is specially designed for industrial customers and provides a leading solution for human machine interfaces.
The AX198A chip supports screen sizes up to 65” and in a wide range of aspect ratios, making it ideal for ultra-wide displays. This chip offers the markets highest report rate and a wide range of modern features, including:
- 3D proximity and hover sensing, enabling air gestures.
- Multi-force sensing and low-latency haptic triggering.
- Parallel multi-touch and multi-force, enabling safety-enhancing systemic redundancy.
- Integrated support for passive and active Dial-on-Display.
- Supporting curved shapes, thick lenses and finger guiding overlays.
- Sensing system which detects and suppresses moisture and water, even when using gloves.
Pricing and Availability
The AX198A with BGA packaging is available now and in stock.
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