Tekdata adds dynamic 3D modelling to interconnect design capabilities

“We chose SolidWorks for its advanced modelling capabilities, including extensions for 3D wire routing,” commented Terry McManus, CTO/Design Centre Manager at Tekdata. “It is the ideal tool for designing with innovative wiring technologies, such as our Computaweave® “branching” cable system, and will help our engineers visualise complex interconnect solutions from the earliest stages of each project.”

Tekdata focuses on space, aerospace, defence, autosport and industrial applications, where extreme environmental conditions, large numbers of signals and tight restrictions on size and weight impose difficult wiring challenges. The company has pioneered robust, highly miniaturised interconnect systems, such as Cryoconnect which features ultra-fine gauge super-conducting wires and Nanoconnect which has extremely small wires and special routing properties.

Now with SolidWorks 3D modelling, which is compatible with most design and drawing file formats in common use, Tekdata is able to begin solving the interconnection challenges as soon as initial mechanical details can be released. Terry McManus expects to be able to reduce both turnaround time and total cost for Tekdata customers.

An important advantage of SolidWorks, according to Terry McManus, is the ability to model wiring even when fixed to a moving assembly such as a hinged access panel or a rotational application, where a cable will need to perform as a ‘clockspring’.

“Complex wiring is traditionally a craft-based activity involving individual engineering judgment,” he explained. “We can now manipulate models to assess upper and lower tolerance limits quickly and accurately. We can also alter wire gauges and insulation details in static or dynamic modes to optimise design parameters. In practical terms, this will help us perfect bespoke wiring such as our harnesses for deep-space telemetry, where optimising cable lengths to save 0.5% of weight can be critical.”