StratEdge high-temperature packaging technology

17th April 2023

Harry Fowle

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StratEdge is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May.

The events will take place in New Mexico, California, and Florida, and will highlight StratEdge's commitment to producing packages that can survive extreme conditions in space and beyond.

At the IMAPS International Conference and Exhibition on High-Temperature Electronics (HiTEC), with an exhibition that runs from 18^th to 19^th April in Albuquerque, NM, StratEdge will be exhibiting at Booth 4. The company will showcase its expertise in packaging for high-temperature applications, including Si, GaAs, and GaN devices.

StratEdge will also be exhibiting at Components for Military & Space Electronics Conference & Exhibition—CMSE, which will be held in Los Angeles, CA from 26^th to 27^th April. The company will be located at Booth B19, and Casey Krawiec, Vice President of Global Sales, will be presenting "Package and Die Attach Comparisons for High Power GaN Devices." The presentation will focus on thermal simulations conducted by StratEdge to compare the thermal dissipative properties of different packaging materials for GaN devices.

In addition, StratEdge will be showcasing power amplifier packages at Space Tech Expo, which takes place from 2^nd to 5^th May in Long Beach, CA. These packages play a crucial role in transmitting signals from commercial and government satellites and other long-range communications equipment. StratEdge will be located at Booth 5027.

Finally, StratEdge will be exhibiting at CS Mantech, which runs from 15^th to 17^th May in Orlando, FL. The company will be located at Booth 211 and will highlight its latest high-reliability package families.

"StratEdge packages have been popular for their heat dissipating properties and high reliability for over 20 years," said Tim Going, President of StratEdge. "With a continued emphasis on increasing power output and pushing the capabilities of chips to deliver ever-higher frequencies, these packages are more critical than ever. Attending these shows enables us to work with engineers to build packages that enable proper functioning of their chips."