Design
Digi Launches Next Generation XBee and XBee-PRO ZigBee Modules
Digi International (NASDAQ: DGII) today introduced a new line of XBee and XBee-PRO ZB embedded ZigBee modules based on the Ember EM357 System on Chip (SoC). The new modules add Surface Mount Technology (SMT) and Serial Peripheral Interface (SPI) to the product family. The SMT modules are ideal for high-volume applications in the energy and controls markets where manufacturing efficiencies are critical. The addition of Serial Peripheral Interface (SPI) provides high-speed throughput and optimizes integration with embedded micro controllers lowering costs of development and shortening time to market.
“T“Ember is the industry’s leading provider of ZigBee networking systems including chips, stack and tools and Digi is a strong partner developing wireless networking solutions,” said Dennis Natale, Ember vice president of sales. “Built on our EM357 ZigBee SoC and EmberZNet PRO stack, Digi’s XBees make it easier, faster and more cost effective to develop many ZigBee Smart Energy solutions and other ZigBee enabled devices.”
XBee and XBee-PRO ZB ZigBee modules feature ZigBee Smart Energy-ready firmware for supporting the implementation of each of the eight devices defined in the ZigBee Smart Energy public application profile. Products developed with the ZigBee Smart Energy profile will be ideal for metering devices, load controllers, in-home displays and other ZigBee Smart Energy devices.
The new modules with SMT will be backwards compatible with existing hardware and software allowing customers to leverage their existing XBee deployments. Available in a variety of protocols for different applications, one XBee can be substituted for another with minimal development time or risk. When coupled with a ConnectPort X gateway, customers canalso use the iDigi™ Platform to easily integrate XBee ZigBee endpoints into their systems.