Bendable non-silicon RISC-V microprocessor

The project explores highly flexible, physically bendable printed electronics, requiring significantly less infrastructure for production. The collaboration points to a future of general-purpose computing driven by sustainable, low-cost, and low-carbon technologies, with contributions from both academic and industry research partners.

The research leverages Qamcom's expertise alongside partners from Harvard University and Pragmatic Semiconductor to demonstrate advancements in the field of flexible electronics. This collaboration showcases how sustainable computing technology can be developed and integrated into real-world applications, setting the stage for next-generation semiconductor innovation.

The project features the award-winning ‘SERV’ CPU, designed by Olof Kindgren, Senior Digital Design Engineer at Qamcom. The processor was integrated into a system developed by Harvard University and implemented using Pragmatic Semiconductor’s printed electronics technology. The research details how this combination of technologies presents a pathway for affordable, environmentally conscious computing.

According to the paper: “Semiconductors have already had a very profound effect on society, accelerating scientific research and driving greater connectivity. Future semiconductor hardware will enable new capabilities in quantum computing, artificial intelligence, and edge computing, for applications such as cybersecurity and personalised healthcare.”

Key highlights of the research:

• The article introduces the Flex-RV 32-bit microprocessor core, based on the RISC-V architecture, which enables the development of an ultra-low-cost, bendable microprocessor
• A programmable machine learning hardware accelerator is integrated into the design, showcasing power consumption of less than 6mW
• The project demonstrates how the Flex-RV will pioneer a new era of sub-dollar, open-standard, non-silicon 32-bit microprocessors. These advances will help democratise access to computing and unlock new applications in wearables, healthcare devices, and smart packaging

Contributors and collaboration

The research was a joint effort involving senior experts from Qamcom, Harvard University’s School of Engineering, and Pragmatic Semiconductor, a leader in flexible integrated circuits.

Contributors include:

• From Pragmatic Semiconductor: Emre Ozer, Jedrzej Kufel, Alireza Raisiardali, Ronald Wong, Nelson Ng, Damien Jausseran, Feras Alkhalil, and Richard Price
• From Harvard University: Shvetank Prakash, Vijay Janapa, David Kong, and Gage Hills from the Harvard John A. Paulson School of Engineering and Applied Sciences
• From Qamcom: Olof Kindgren, designer of the SERV CPU

Olof Kindgren commented: “Qamcom is an expert design house with deep knowledge of RISC-V, committed to sustainable computing and continual collaboration with expert partners. Collaborating with like-minded experts from Pragmatic and Harvard for sustainable and low-cost, low-carbon footprint solutions continues both my own and Qamcom’s dedication to turning technology into value.”

This research opens up exciting new possibilities for affordable and environmentally friendly computing, paving the way for breakthroughs in emerging fields such as wearable technology, healthcare, and smart packaging.

The full article can be found on Nature.com: 'Bendable non-silicon RISC-V microprocessor'.