Baya Systems and Semidynamics have announced a collaboration to boost innovation in development of hyper-efficient, next-generation platforms for AI, ML and HPC applications.
The collaboration integrates Semidynamics’ family of 64-bit RISC-V processor IP cores, known for their exceptional memory bandwidth and configurability, with Baya Systems’ innovative WeaveIP Network on Chip (NoC) system IP. WeaveIP is engineered for ultra-efficient, high-bandwidth, and low-latency data transport, crucial for the demands of modern workloads. Complementing this is Baya Systems’ software-driven WeaverPro platform, which enables rapid system-level optimisation, ensuring that key performance indicators (KPIs) are met based on real-world workloads while providing unparalleled design flexibility for future advancements.
New computational platforms are needed to address the challenges of advanced AI and machine learning in market segments such as data centres, infrastructure, automotive and edge IoT applications. To keep pace with technology advancements, these platforms must balance processing power with efficient data movement. As AI, ML and HPC workloads grow exponentially and systems shift to larger scales and chiplets, the focus is shifting from raw compute power to efficient data transfer between processors and chiplets.
“Our customers need high-performance compute that doesn’t get bottlenecked by inefficient data transport,” said Roger Espasa, CEO of Semidynamics. “Partnering to pre-integrate with Baya Systems’ WeaveIP technology accelerates development timelines for our mutual customers, eliminating this bottleneck and enabling a new level of performance for AI and HPC applications.”
Baya Systems, fresh off its Series B funding, has emerged as a key player in semiconductor innovation. Its NoC solutions are chiplet-ready and engineered for extreme scalability, seamlessly complementing Semidynamics' flexible, high-bandwidth architectures.
“Our mission is to support our customers’ processor IP choices while providing the SoC connectivity backbone for the expanding RISC-V ecosystem,” said Dr. Sailesh Kumar, CEO of Baya Systems. “Together with Semidynamics, we’re enabling SoC designers to push the boundaries of performance, efficiency and scalability in AI and HPC applications.”
Both Semidynamics and Baya Systems will be at embedded world 2025 in Nuremberg, Germany from March 11-13, where they will showcase how their technologies accelerate next-generation SoC designs.
