Adeneo Embedded Releases Microsoft Windows Embedded Compact 7 Board Support Packages for NXP MCUs

Windows Embedded Compact 7, the next generation of Microsoft’s widely used Windows Embedded CE platform, provides a complete toolkit for OEMs building specialized consumer and enterprise devices, including the latest Windows 7-based technologies and tools for creating engaging user experiences and streamlined connectivity to Windows 7-based PCs, servers and online services. The Windows Embedded Compact 7 public community technology preview (CTP) was announced on June 1st at Computex Taipei.

The LPC3250 MCU from NXP Semiconductors is designed for low power, high performance applications. It implements an ARM926EJ-S CPU core with a vector floating point co-processor and a large set of standard peripherals including USB On-The-Go. The LPC3250 operates at CPU frequencies of up to 266 MHz.

Sample demonstration binary images of the new BSPs are now available as free downloads from the Adeneo Embedded website. Device makers can immediately start their evaluation and testing of Windows Embedded Compact 7 on the NXP architecture. The full source code is also available on the Adeneo Embedded website for a one-time license fee that is 100% royalty-free and includes 90 days of free support and maintenance.
“Adeneo Embedded is very proud to provide the release of another new BSP for Windows Embedded Compact 7,” said Yannick Chammings, CEO of Adeneo Embedded. “Now OEMs can evaluate the new Windows Embedded Compact 7 platform on the NXP architecture early in their device development stage.” Chammings continued, “Our immediate support for Windows Embedded Compact 7 furthers our leadership in developing the most current reference solutions for Windows Embedded technologies in collaboration with leading Semi-Conductor Vendors.”

Microsoft is pleased to be working with Adeneo Embedded to assist OEMs in bringing rich, connected devices to market quickly,” said Valerie Olague, senior partner manager for Windows Embedded at Microsoft Corp. “Adeneo Embedded’s proven BSPs combined with Windows Embedded Compact 7, provide the latest tool and technologies for OEMs developing on the NXP processor-based micro-controllers, as well as additional platform designs.”

“The addition of the Windows Embedded Compact 7 BSP to the LPC3250 further completes the software eco-system supporting our broad range of ARM-based microcontroller solutions”, said Geoff Lees, VP and general manager for Product Line microcontrollers, NXP Semiconductors. “With the technical expertise offered by Adeneo Embedded on Windows Embedded Compact and LPC3250 architecture, our customers can develop next generation consumer applications with ease and bring them to market quickly.”

PQOAL compliance for the easiest adaptation to custom designs – Strict compliance with Microsoft PQOAL (Production-Quality OEM Adaptation Layer) and PQD (Production Quality Device) specifications ensure BSPs from Adeneo Embedded are a very cost-effective way to develop custom solutions on the NXP LPC3250 architecture for Windows Embedded Compact 7 with minimal redesign. Only the portions of the BSPs handling board features need review, and all code linked to the core CPU are reusable without modifications.

Strong reliability to ensure the best quality – Adeneo Embedded BSPs are qualified using the Windows Embedded Compact 7 official test kit and have been designed to take full advantage of the advanced features of the NXP LPC3250 such as communication, graphical and audio performances.

The Adeneo Embedded strength in reference BSP development and deep expertise in the advanced features of Windows Embedded Compact 7, such as the Silverlight for Windows Embedded user interface framework, enables a complete range of services, including training, support and application development. Device OEMs can benefit from timely access to new technologies and the expertise of the Adeneo Embedded engineering teams located in Europe and North America to secure designs in the best time to market.