Adeneo Embedded launches Windows Embedded Compact 7 support for TI’s OMAP 4 platform

Combining TI’s multicore OMAP 4 applications processor technology with Microsoft’s recently released Windows Embedded Compact 7 platform of tools and technologies creates new opportunities to develop innovative multimedia and wireless devices for enterprise and industrial applications. Example advanced features include an ARM® Cortex™-A-optimized compiler, support for symmetric multiprocessing and advanced graphical capabilities with Silverlight for Windows Embedded.

An active member of TI’s Developer Network, Adeneo Embedded, marries its deep working knowledge of the OMAP technology with its Windows Embedded Compact legacy to create a breadth of expertise invaluable to OEMs seeking to differentiate on related designs. This expertise uniquely positions Adeneo Embedded to deliver superior customer services supporting system integration, Board Support Packages (BSP), drivers and application development as well as performance optimization.


Windows Embedded Compact 7 provides developers, designers and original equipment manufacturers (OEMs) with a powerful real-time OS and a full tools suite, enabling an integrated, streamlined development experience that helps speed devices to market.

The OMAP 4 platform is a powerful system-on-chip that includes a high definition (HD) multimedia engine, a dual-core ARM(r) CortexTM-A9 MPCoreTM supporting symmetric multiprocessing (SMP) and capable of speeds of more than 1GHz per core; a high-performance programmable graphics engine; and an Image Signal Processor (ISP) for unparalleled video and imaging performance.


The richness of features provided by TI’s OMAP 4, combined with Adeneo Embedded system integration expertise on Windows Embedded Compact 7 is an excellent solution to ensure OEMs’ design success, said Yannick Chammings, chief executive officer, Adeneo Embedded. Device makers using Multicore Cortex-A9 architecture have the highest level of expectation in terms of performances and capabilities for their devices, and this requires top-level expertise, both on OS integration and on processor architecture. OEMs can now rely on Adeneo Embedded engineering teams located in Europe and North America to receive best-in-class support for their OMAP 4 / Windows Embedded Compact 7 based developments.”

“We’re pleased to have Adeneo Embedded leverage its Windows Embedded expertise to assist OMAP 4 customers using the Windows Embedded Compact 7 operating system,” said Mike Schoonover, OMAP 4 business development manager, wireless business unit, TI. “Customers now have access to support services tailored specifically to Windows Embedded Compact 7 integration on the OMAP platform, resulting in their ability to differentiate their designs while bringing products to market quickly.”

“We are excited to work with Windows Embedded partners Adeneo and Texas Instruments to help OEMs and developers bring high performing, reliable and differentiated devices based on Windows Embedded Compact 7 to market more quickly”, said Valerie Olague, group regional marketing manager for Windows Embedded, Microsoft. “With the release of Windows Embedded Compact 7, Microsoft together with our partners continues to be at the forefront of innovation in specialized devices.”