Design

SystemCrafter has announced its participation in the Xilinx ESL Initiative. This collaboration will help SystemCrafter to drive integration and adoption of SystemC to VHDL software as part of the ESL methodology for FPGAs, and enable the company to more rapidly develop enhanced versions in the future.

picoChip has announced a reference design for an ultra-low cost 3G/HSDPA basestation for use in a home or small office as an alternative to WiFi and UMA (Unlicensed Mobile Access). The PC8208 modem reference design for a 3G access point or “femtocell” basestation supports HSDPA with a software upgrade to HSUPA.

Designed to provide a fully customised embedded solution with minimal engineering and adaptation costs, the new GX2 ETX module from DSL is a complete processor core which will enable a custom product to be developed and brought to market quickly and easily.

Providing multiple connections including a 16-bit x-ISA bus with interfaces for COM, PRN, IDE and GPIO, the new Mity-SoC Module from ICOP Technology (UK) makes application design even easier with the integration of a DM&P 6117D CPU, 2/4MB of onboard DRAM, BIOS and the multi I/O.

Priced to make powerful embedded PC/104 computing available to the majority of industrial budgets and requirements, the new VEGA86-6270 from ICOP Technology UK is available with or with a passive thermal management system.

Providing box header connectors for IDE, LCD, FDD, printer, RS232 (5) and USB, plus other connections for VGA, RS485, Ethernet and keyboard/mouse, the new Vortex86 6047-4S from Icop Technology UK covers the majority of industrial embedded requirements.

Arcom, a Gold level Windows Embedded Partner, has released updated Development Kits for two embedded single board computers - the ultra-low power 400MHz PXA255 XScale based VIPER and the AMD Geode based SBC-GX1.

Arcom has launched another Pentium ‘board support package’ development kit to support Wind River’s VxWorks 5.5 real-time operating system (RTOS), the most widely adopted RTOS in the embedded industry.

The CX6000 family of Structured ASICs from ChipX is fabricated in a high performance, eight-metal 0.13-µm process, and is said tothe accelerate time-to-market and reduces risk by integrating silicon proven IP subsystems into the Structured ASIC fabric.

ChipX has announced the CX6100 family of Structured ASICs - the latest addition to the company’s growing portfolio of Structured ASICs with embedded IP.