Design
Comms Design Made Easier Through Solid State Supplies Deal
Solid State Supplies continues its growth programme with the announcement that the company has been appointed the UK and Ireland franchised distributor for FieldServer and its family of Industrial Communications Protocol modules.
NEW ICOP 6015H MODULE SHOWS YOU WHAT’S GOING ON
The latest 386-SX module from ICOP Technology UK incorporates LED status indicators for NET activity, NET link and Power in addition to many other features.
Aldec Extends Code Coverage Analysis Offering
Aldec, Inc. has announced the addition of Expression Coverage for Verilog in the release of Riviera 2006.06. This addition significantly improves efficiency of the verification process and enables delivery of higher quality, more reliable designs.
Avago validates its SerDes core in 65 nm CMOS process technology
Avago Technologies has announced it is among the first manufacturers to validate its SerDes core in 65 nm CMOS process technology. This milestone advances the state of SerDes ASIC core design from today's mainstream 90 nm to 65 nm process technology. With over 25 million embedded SerDes channels shipped, Avago extends its leadership position as a supplier of innovative embedded SerDes cores for OEMs building next generation networking, computing ...
SysML "standardized" following its adoption by OMG
ARTiSAN Software Tools, a global leader for UML 2.0 and SysML-based real-time systems and software modelling tools, has warmly welcomed the standardisation of SysML following its adoption by The Object Management Group earlier this month.
Custom design kits for X-FAB’s new fabs expand process choice for analogue and mixed-signal chip designers in a hurry
EDA Solutions, exclusive European representative for analogue and mixed-signal tool vendor Tanner EDA, has introduced a 14-day service for custom design kits so that users of the company’s chip layout tools can take advantage of the new 0.25, 0.18 and 0.15 micron processes that have become available since X-FAB’s recent merger with 1st Silicon, Malaysia's premier 200mm wafer foundry.
TurboTools™ Announces Add-In Integration and Certification for Autodesk Inventor 11 Software
TurboTools Corporation, provider of HES and Systems Design Productivity Solutions announced today the availability of a plug-in that links CablEquity 2006 with Autodesk Inventor, the world’s best-selling 3D mechanical design software. The company also announces that CablEquity 2006 has been certified for Autodesk Inventor 11 under the Autodesk Inventor Certified Applications Program.
Software for Design of Electric Motors
Infolytica Corporation has announced that MotorSolve, the newest addition to its industry leading software family, will be released in the third quarter of 2006. The package will offer an accurate FEA-based design environment which focuses exclusively on electric motors.
Ultra Low Power SBC for embedded industrial applications
Designed specifically for embedded applications using ultra-low power and boasting an overall power consumption of just 4W, the new DSL-800LX from Datasound Laboratories has all the features required from a high performance computer.
Development Kit allows fast design of embedded Linux devices
Arcom’s new Development Kit allows faster and easier development of a wide range of embedded devices in a Linux environment. The kit’s SBC-GX533 board has a compact Arcom Embedded Linux image installed in its onboard Flash. All onboard hardware features are supported, allowing unrestricted access to their functionality, while all unnecessary software functions have been removed, leaving a compact image of just 13 MB. This can save weeks or ev...