Design

The Arcom QUANTUM PXA270 based SO-DIMM format SBC module gives OEMs an extremely low power, high performance and cost effective computer component for easy integration into their application specific motherboards. Its ready to run potential eliminates the work and risk involved with designing the complex processor core and operating system element. Designers can focus on the I/O and interface features unique to their market application.

QuickLogic has launched a new website that will help mobile electronics product development teams to bring designs to market more quickly, and with lower risk. The site details QuickLogic's capability in Customer Specific Standard Product (CSSP) technologies and platforms.

Toshiba Electronics Europe (TEE) has announced the availability of a new demonstration kit that will allow engineers to rapidly assess the company’s latest high brightness surface mount LED devices. The Toshiba SMD LED Demo Kit showcases 33 of the company’s LEDs delivering a total of ten different colour options. Pushbuttons allow the user to illuminate all of the LEDs for each individual colour, which include green, yellow, orange, red, blu...

Three years after the 2004 launch of the ETXexpress specification, which has become the PICMG COM Express (COM.0) standard, Kontron defines a new footprint variant of the Computer-On-Modules (COMs) standard: nanoETXexpress.

Everything is possible with innovative thinking. NEXCOM has successfully integrated Intel's Q965 chipset into the PEAK 765VL2 Single Board Computer to comply with the PICMG 1.0 standard. The PEAK 765VL2 becomes the first PICMG 1.0 SBC to support Intel Core 2 Duo processor up to 1033 MHz Front Side Bus and to provide backward support of ISA peripherals.

Green Hills Software, Inc., the technology leader in device software optimization (DSO) and real-time operating systems (RTOS), has announced that its product suite, including the MULTI integrated development environment, µ-velOSity royalty-free real-time operating system, TimeMachine tool suite, Green Hills compilers, and Green Hills Probe are now available for the Freescale i.MX27 multimedia applications processor. This new support enables c...

Telelogic has announced Telelogic Change 4.7, a web-based and highly scalable software solution that provides problem tracking, change request and workflow management across the enterprise. Part of the company’s overall application lifecycle management (ALM) solution set, Telelogic Change 4.7 allows stakeholders ranging from developers to quality professionals achieve better and more consistent results.

Renesas Technology Europe and its Platinum Alliance Partner MPC Data Limited have announced the immediate availability of a Linux Board Support Package (BSP) for the popular SH7712 Renesas 32-bit SuperH® microprocessor. The Linux BSP is targeted for the development platform MS7712SE01 that provides an excellent basis for engineers to design new products, shorten their development time and get products to market faster.

PMC-Sierra has announced the availability of the PAS65311 GPON ONT Reference Design. The solution features PMC-Sierra’s GigaPASS architecture, the only ONT solution already deployed in millions of PON devices. It includes a fully featured ITU-T G.984 GPON MAC, an advanced classification engine, robust QoS queuing, advanced VLAN bridging and manipulation, and IPTV filtering, all performed at line-rate speeds for all packet sizes. The solution ha...

Freescale Semiconductor and STMicroelectronics have made significant progress in the areas of automotive IP development, flash technology alignment and new product definition. Since announcing their joint design initiative last year, the automotive units from ST and Freescale have focused product development efforts on a wide range of automotive applications, including powertrain, chassis, motor control and body systems using Power Architecture t...