Design
New VCE6467 Video Communications Engine integrates TI hardware and RADVISION software
Video communications designers can now benefit from an integrated video communications solution – pre-installed software on a video processor chip, available from a single vendor. The VCE6467 Video Communications Engine from Texas Instruments Incorporated and RADVISION’s Technology Business Unit is a cost-conscious solution easily enabling a variety of two-way, live HD video communications applications, including video conferencing, telemedi...
UMC Uses Silicon Frontline’s Field Solver to Generate Reference Extraction Data
Silicon Frontline Technology, Inc. (SFT) announced today that its 3D extraction software for post-layout verification F3D (Fast 3D) has been qualified by United Microelectronics Corporation (NYSE: UMC, TSE: 2303) (UMC), a leading global semiconductor foundry, as the reference field solver for parasitic extraction.
Freescale furthers embedded development capabilities with addition of five advanced Tower System modules
Freescale Semiconductor continues to enable advanced development through rapid evaluation and prototyping with its Tower System development platform. Today, the company announced two processor modules, three interchangeable peripheral modules and a number of partner-developed modules for the reconfigurable development platform.
Leading RTOS & middleware companies integrate with IAR Embedded Workbench to become part of unique development tools ecosystem
IAR Systems today announced the launch of their new RTOS & Middleware Partner Program for IAR Embedded Workbench. By selecting some of the best and most recognized RTOS products from around the world, the Program will provide a broad and comprehensive development tools ecosystem of RTOS and middleware products, all highly integrated with IAR Embedded Workbench.
Wind River to Launch Updated Simics Virtual Systems Development Solution
Wind River today announced Wind River Simics 4.4, a virtual systems development solution that allows engineers to define, develop, and deploy their product using a virtual representation of their target hardware.
VIA Preps Embedded Industry for Next-Generation Devices at Computex 2010
VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its attendance at Computex 2010, showcasing a range of exciting platform, board and system level designs that are set to revitalize the embedded industry for years to come. Join VIA at Computex 2010, Nangang TWTC, Booth L1018.
Zuken Launches Automatic Wiring Diagram Generation Tool
Zuken has introduced the E³.Wiring Diagram Generator, a new tool for the automatic creation of schematic wiring diagrams as part of the 2010 version of E³.series, the state-of-the-art solution for wiring, harnesses, cable, fluid, hydraulics, and panel design. The new module generates schematic wiring diagrams for engineering and after-sales documentation.
AAEON Launches Flexible Embedded System
AAEON has launched a brand new product line called Flexible Embedded Systems (FES). The FES series represents compactness, high flexibility, and convenience. The economically priced unit is another favorable reason for those who want to cultivate the embedded market, but have limited budgets and/or requirements.
New Debug Platform for SoC Verification
Mentor Graphics and Lauterbach GmbH, the world′s largest supplier of hardware-assisted embedded debug tools, today announced they have collaborated to deliver a hardware-accelerated, software-development and debug platform for the verification of Systems-on-Chip (SoC′s) and embedded systems.
Cadence Captivates Delegates at CDNLive! EMEA With New EDA360 Vision
Cadence Design Systems opened its annual CDNLive! EMEA user conference in Munich with a call to action for the semiconductor and EDA industries to join in embracing the EDA360 vision. Now in its fifth year, CDNLive! brings together Cadence® technology users, developers and industry experts to discuss design challenges and cost-effective solutions. More than 550 delegates from over 130 companies and universities attended the conference.