Design
Renesas launches Cloud-based environment
Renesas has launched a new Cloud-based development environment aimed at streamlining the software design process for automotive AI engineers.
The most precise volumetric dispenser now available
To enable electronics and medical device manufacturers to dispense small volumes of liquid with high precision and accuracy, the most precise volumetric dispensing technology currently available is now offered by adhesives and dispensing equipment specialist Intertronics.
From mass production to mass personalisation
It’s no secret that robotics and automation have been key drivers in achieving mass production. But as manufacturers seek to offer a wider variety of products able to fit individual customer needs, can automation bring personalisation to the same scale?
ASRock Industrial’s 4X4 BOX 8040 series mini PC
ASRock Industrial has released a 4X4 BOX 8040 series of mini PCs and 4X4 8040 motherboard series, powered by AMD Ryzen 8040 series APUs, crafted to elevate trusted performance and AI PC capabilities.
Crafting an Elf-detecting AI for your Elf on the Shelf antics
In a unique take on the Christmas tradition of Elf on the Shelf, YouTuber Kevin McAleer introduced a high-tech element to this festive game.
GigaDevice partners with SEGGER on Embedded Studio for RISC-V
GigaDevice customers can now use SEGGER's multi-platform IDE Embedded Studio free of charge across all GigaDevice RISC-V microcontrollers (MCUs) including the latest GD32VW553.
High thermal impact reliability no-clean solder paste
SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications.
Continental and Synopsys vehicle digital twin capabilities
Continental has announced a collaboration with Synopsys to accelerate the development and validation of software features and applications for the Software-Defined Vehicle (SDV).
BUMAX receives fastener order for prototype reusable rocket
French spacecraft designer and manufacturer OPUS Aerospace has selected screws from BUMAX for its new suborbital rocket and upcoming space vehicles intended for satellite deployment.
Opening a new nanoscale lane on the heat transfer highway
In the realm of heat transfer, thermal energy is conveyed by quantum particles known as phonons. However, at the nanoscale relevant to today's advanced semiconductors, phonons aren't sufficient for effective heat removal. Therefore, Purdue University researchers are exploring a novel approach by employing hybrid quasiparticles called ‘polaritons’ to enhance this process.
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Analog Devices Inc.
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