Design

An advanced electron beam (EB) welding technology, developed by Cambridge Vacuum Engineering (CVE) has the potential to transform the speed at which small nuclear power stations can be built.

Weller Tools, a specialist in hand soldering solutions, is set to make waves at the upcoming 2024 IPC APEX EXPO, taking place 9–11 April 2024 at the Anaheim Convention Centre in California.

SEGGER and GigaDevice announce their collaboration to provide customers with SEGGER emWin embedded system graphics library, free of charge.

Siemens Digital Industries Software has announced that South Korea-based nepes corporation, which delivers Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.

The HZ30B chip cooler is the response to increasing demands for embedded computing cooling.

Fairview Microwave, an Infinite Electronics brand and a provider of RF, microwave, and millimetre-wave products, has announced its latest product innovation: standard gain horn antenna radome covers.

avercasso, a coffee equipment maker, is thrilled to announce that its innovation, the CS One, has received prestigious global recognition at the iF DESIGN AWARD 2024

PowerCell announced a five-year framework agreement for serial deliveries of fuel cell systems with the British company ColGar Energy, a subsidiary of the Vantastec Group.

IMDT, a global provider of vision and AI-powered products and systems, has announced a new line of power-efficient, cost-effective, and ready-to-use system-on-module (SOM) and single-board-computer (SBC) solutions, based on the new Renesas RZ/V2H microprocessor.

Nexperia, the global semiconductor manufacturer, has introduced a new series of four- and eight-channel analog switches designed to monitor and protect 1.8V electronic systems.