Design
RED Semiconductor announce VISC licensable high performance processor architecture for RISC-V
RED Semiconductor has announced VISC, an algorithmic microprocessor ISA (Instruction Set Architecture) and hardware design that extends the capabilities of RISC-V for Edge AI, autonomy and cryptography.
STMicroelectronics all-in-one MEMS studio
STMicroelectronics’ MEMS Studio is a new all-in-one tool for MEMS sensor evaluation and development, connected closely with the STM32 microcontroller ecosystem and available for Windows, MacOS, and Linux operating systems.
Arrow & Infineon introduce 240W USB PD3.1 reference design
Arrow Electronics, in collaboration with Infineon Technologies AG, has unveiled a 240W USB Power Delivery (PD) 3.1 reference design board, designed to facilitate high-power applications for customers.
C-LEO: £60M for innovative satellite constellation ideas
Up to £60 million is available for innovations that will help boost the UK’s satellite communications sector, following the record number of global satellite launches in 2023.
Custom silicon chips for printed electronics material characterisation
How efficient are new materials? Does changing the properties lead to better conductivity? The Fraunhofer Institute for Photonic Microsystems IPMS develops and manufactures silicon substrates for this purpose.
Dielectric trends in next-gen semiconductor packaging
The semiconductor industry continually pushes packaging technology boundaries to meet the demand for higher chip performance and efficiency.
Avnet launches MaaXBoard OSM93 development kit
The new MaaXBoard OSM93 development kit from Avnet is the latest single-board computer (SBC) to be added to the popular MaaxBoard series of SBCs based on the i.MX 8 and i.MX 9 series of NXP Semiconductors* application processors.
Ricardo and Greenjets celebrate eVTOL propulsion milestone
Ricardo has played a key role in assisting Greenjets in developing the inaugural generation of an electric, fully operational demonstrator propulsion module named InCEPTion, designed for aircraft under five tonnes.
Ventec to launch new bondply dielectrics and value-added services
Ventec International Group has announced its plans to unveil new products aimed at enhancing signal integrity and thermal performance, alongside introducing new services at the IPC APEX Expo 2024, scheduled for 9-11th April at booth #4309.
New processor achieves remarkable speedup in problem solving
Researchers have designed a scalable, fully-coupled annealing processor with 4,096 spins, with parallelised capabilities for accelerated problem-solving.