Design

TactoTek, the global specialist in Injection Moulded Structural Electronics (IMSE) technology, announces that it has received its 250th patent grant spanning 48 patent families.

Family-owned company, Leutz Lötsysteme GmbH, specialises in the development, design, and production of soldering systems.

The EPC9192 Class-D audio reference design enables high power and high efficiency in a modular design for customisation and high performance.

congatec – a provider of embedded and Edge computing technology – presents new rugged SMARC modules based on the Intel Atom x7000RE processor series (codenamed Amston Lake) and the Intel Core i3 processor.

MIKROE has announced that the latest version of its multi-architectural IDE, NECTO Studio 6.1, now includes Microchip's MPLAB XC compilers for 8-, 16- and 32-bit MCUs.

Renesas has announced new features and additional coverage for its Quick Connect Studio, a Cloud-based embedded system design platform.

Indium Corporation’s Senior Research Metallurgist, Jie Geng, PhD., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.

The demand for high-performance devices with enhanced functionalities continues to grow. Materials, such as graphene and MoS2, exhibit unique electrical and mechanical properties making them ideal for flexible electronic applications.

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilised for underfill, coating, impregnating, and porosity sealing applications.

DigiKey, one of the leading global commerce distributors offering the largest selection of technical components and automation products in stock for immediate shipment, is excited to announce its teaming up with NXP Semiconductors to launch the MCX MCU Design Contest at embedded world.