Design

ASMPT and IBM have announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies.

Infineon Technologies has announced the release of a comprehensive evaluation kit for embedded, Edge AI, and machine learning (ML) system designs.

A former principal mechanical engineer from a leading UK prosthetics firm has achieved notable advancements in creating more comfortable, functional, and affordable upper limb prosthetics through Heriot-Watt University's DeepTech LaunchPad programme.

Avnet ASIC has announced that it has launched its new low-power design services for TSMC's 4nm and below process technologies.

ProTek Devices has a new TVS array that delivers circuit protection in industrial automation equipment, sensors, and power or data line applications. The new TVS array is a high-surge green device, having no lead content.

In celebration of Disability Pride Month, mental health campaigner and disabled adventurer Nick Wilson has achieved a remarkable feat by reaching the highest accessible point on Yr Wyddfa (Mount Snowdon) ‘unaided’.

Surf-Tech Manufacturing, a multi-faceted provider of contract manufacturing services, is pleased to announce the expansion of its advanced conformal coating services.

Nanusens has announced that it has used its pioneering MEMS-within-CMOS technology to create a novel solution to the challenge of creating better RF front ends for 6G. 

Indium Corporation is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms.

Renesas has announced a complete space-ready reference design for the AMD Versal AI Edge XQRVE2302 Adaptive SoC.