Thermal profiling equipment on display in Munich

APS is a full time system for profiling each and every PCB soldered in a convection reflow oven.The APS system allows 100% checking of temperature profiles, an automatic analysis of the profile, and checking of production parameters against production limits. The computer software tracks the progress of the PCB through the oven allowing for the most accurate calculation of the profile seen at product level.

Mark Stansfield, managing director at SolderStar Ltd said:“SolderStar APS has been re-engineered so the temperature probes are smaller, allowing them to be positioned closer to the PCB providing a much more accurate temperature measurement in the vicinity of the electronic assembly during soldering. The smaller size also reduces the danger of the probe shadowing the product. APS also includes a sophisticated computer algorithm which uses a reference profile, captured once from a traditional profiling system along with live readings from the process, to calculate a mathematical profile for each PCB exiting the oven. The algorithm used by the software to produce this profile from the live readings and reference profile has been modified based on the input of a leading mathematician to yield more accurate results.