Stencil confronts electronic assembly demands

Addressing the demands confronting the electronic assembly industry, the stencil incorporates the next generation of stencil technology. Both highly hydrophobic and oleophobic, the stencil coating is based on a proprietary application process that coats both the underside of the stencil and aperture walls whilst repelling solder paste. The coating is thermally cured, making it permanent. The stencil technology improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. NanoSlic minimises bridging and reduces underside cleaning, with the technology easily evaluated and compatible with current assembly equipment and processes.

“We have capitalised on our extensive knowledge and expertise in solder paste, polymer chemistry and stencil technology to develop NanoSlic,” said Mike Scimeca, President of FCT Assembly. “We are very excited to bring this technology to the marketplace.”