Solder pastes reduces tombstoning potential

Typically occuring when one solder paste deposit reflows before the other, tombstoning occurs when components lift up during reflow causing an open pad at one end. Creating a temperature difference from end-to-end of the component during reflow, tombstoning is commonly found on circuit boards that have a ground plane attached to one end of a small component

FCT’s anti-tombstoning solder pastes are designed for use when it is difficult to change the reflow profile. FCT achieves anti-tombstoning properties through modification of the alloy to introduce a melting range which equalizes wetting forces, and therefore preventing small components from tombstoning. The pastes feature excellent performance when tombstoning is a concern and excellent wetting characteristics on all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn and Ag. Additionally, the pastes are available in no-clean and water soluble as well as lead-free and leaded formulations.