Solder paste is first to boast temperature stability

The innovative formulation of Loctite GC10 is temperature stable at 26.5°C for one year and stable at temperatures of up to 40°C for one month, enabling exceptional performance throughout the logistics and operations chain, from shipping through to final assembly. Loctite GC10 offers significant improvements over conventional solder paste materials. While the average abandon time of traditional materials ranges from one to four hours, the halogen-free, lead-free temperature-stable formula of GC10 enables an abandon time of up to 24 hours and no startup time is required.

Other key features include stabilised and consistent print transfer efficiency, soak temperatures between 150 and 200°C, an expanded reflow window and increased activity for better results. Significant cost savings can be made due to the solder system’s stability on the line providing paste utilisation of more than 95%. The reductions in solder-related defects achieved with Loctite GC 10’s process performance result in higher yields and improved profitability. Not only will manufacturers see process improvements and cost reductions due to Loctite GC 10’s
unmatched performance, they will also experience a resolution to long-standing logistics and storage challenges.

Loctite GC10’s temperature stability will eliminate the requirement for cold packing, overnight shipping and refrigerated storage. Furthermore, packaging and shipping costs are reduced and energy consumption within the factory is decreased. Having been tested by numerous customers worldwide, the results of the material’s performance suggest future commercial success with widespread integration into electronics manufacturing operations worldwide.